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ASTM B568
SEM EDS Manual
Dimensional Measuring Microscope
CHAMBER Manual

Circuit board testing, printed circuit board testing, test circuit boards

provides A2LA accredited (ISO 17025) laboratory services for cross sectional analysis of circuit boards, dimensional measurement of circuit boards, chemical analysis of circuit boards, physical properties of circuit boards, and accelerated aging of circuit boards. In addition to circuit board testing, our laboratory also does plastic testing, metal testing, rubber testing, oil testing, paint testing, plating testing, adhesive testing, and other testing.


Cross Sectional Analysis of a Circuit Board

Cross sectional measurements of plated through hole (PTH) quality, ball grid arrays (BGA), inner plane separation, inner plane registration, wicking, and dielectric layer thickness are all good indicators of circuit board quality.


Dimensional Measurement of a Circuit Board

XRF Measurement (ASTM B568) can non-destructively measure the thickness of metallic coatings to the nearest micro-inch. If the gold plating, nickel plating, tin plating, solder, or other coatings are not the right thickness then they may not provide adequate protection or contact resistance.


Chemical Analysis of a Circuit Board

Contamination on a circuit board can create short circuits which will damage the board or cause a malfunction. EDS analysis can be used to identify ionic contamination and SEM Examination can show images of the location of a contaminant.


Physical Properties of a Circuit Board

Circuit board assembly is a major contributor to the overall quality of a circuit board. Optical microscope inspection (ASTM B487) for flux residue, poor solder joints, inaccurate placement, delamination, or other defects is a good first step in a quality program. Solderability (ASTM B678) measurements indicate how well a surface is prepared prior to populating with components. The actual strength of connectors and adhesion of leads can be measured with custom tensile strength measurements. Destructive physical analysis (DPA) can be used to locate the source of failures.


Accelerated Aging of a Circuit Board

Temperature and humidity chambers are used for environmental cycling of circuit boards for initial burn in purposes or to simulate extreme performance conditions which could cause failure over time. Vibration testing is another accelerated test which can induce failures due to vibration during transportation or service. Solder shock testing is used to show how well a circuit board is likely to maintain integrity during soldering processes.

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